Molex QSFP-DD BiPass next-generation solutions provide a cooling arrangement

Global e-solutions provider Molex Introduces New BiPass cooling thermal management configuration module QSFP-DD, the module can handle up to 20 watts of power, will reduce the ambient temperature of 15 degrees Celsius. The Molex QSFP-DD thermal solution for cooling power within the range of 15 watts to 20 watts in a variety of different configurations. BiPass module solution allows for higher wattage cooling, to help designers speed of 112 Gbps.
With the release next-generation copper and fiber optic cable QSFP-DD transceiver is ready Control Engineering Copyright , thermal management strategy is playing a crucial role. Molex QSFP-DD shows the front portion of the front portion arranged BiPass, QSFP-DD front portion of the front portion arranged SMT, 2×1 QSFP-DD stacked configuration, and a dual-band radiator in the vertical direction of QSFP-DD BiPass 1×2 configuration. All configurations are run at 15 watts , at any temperature below 25 ° C can be cooled. BiPass solution can transmit high-speed signals by a coaxial cable path Temp-Flex double, compared with a printed circuit board alone to achieve greater balance channel, and allows a second radiator is provided at the bottom side of the holder, module has contact with the CONTROL ENGINEERING China Copyright , to provide further cooling. Chris Kapuscinski Molex, global product manager, said: “If you need 15 watts of cooling module, so today there are many different solutions we are now able to cool .BiPass solutions for higher wattage modules can save designers. significant cost CONTROL ENGINEERING China Copyright , and is an important factor in promoting 112 Gbps embodiment of the PAM-4. “BiPass solution enables designers to use high-speed dual coaxial Temp-FlexThen use without loss of printed circuit board will occur. Thus, when the rack from the ASIC in the switch or router to route to another server, they can reduce the insertion loss. Radiator technological advances are enabling efficient, reliable and flexible thermal management strategy has, in copper and fiber optic connections can support higher density. From the viewpoint of the future, such excellent signal integrity performance and low insertion loss feature allows designers generally passive copper throughout the design. Kapuscinski added: “As the demand for faster data rates continue to rise Control Engineering Copyright , data center technology is the rapid progress, and thermal management techniques must go forward .BiPass solution uses advanced materials, the latest tools and top-notch technology, the system can provide better temperature control, and it will not affect the performance. “to learn more on Molex solve the thermal management capabilities and solutions in the data center, visit

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